Circuit Assembly and Testing
Product design / engineering
Prototyping with SMD PTH components
Producing lots in manufacturing account or full account
Processing, planning and testing with dedicated equipment
Our structure is composed of
Procurement which is in contact with the major suppliers and multinationals operating in the field of electronic components. We can make assessments of cost, quality and present or future availability (purchase of all materials or any portion thereof).
Logistics which makes use of MODULA vertical storage modules able to properly handle and store the components. The system is connected to the company’s software platform that updates in real time withdrawals, availability and purchasing information allowing the control and traceability of the handled materials.
PTH/SMD boards assembly of high end quality thanks to the excellent plant machinery capable of assembling with very high speed and precision both traditional components and components of the latest generations such as POP, UBGA, DFN and LGA.
The same machines carry out an accurate control of the components and their positioning using both laser technology and graphical analysis of the images of the components that are sent to the processors from the miniaturized cameras. The components that do not comply are automatically discarded during the assembly process.
The mounting ends with the welding by means of Vapour Phase technology, which ensures perfect joints in respect of the components and of the thermal curves provided by the manufacturers. This process is useful to avoid excessive thermal stress and is essential for aluminum circuits used in new lighting technologies and many special applications.
For the welding of the PTH components we are able to offer processes both with sn/lead alloy and lead-free, both no-clean.
On request we proceed with the washing of boards using fully automated machinery.
Control of all boards through an accurate automated optical inspection (AOI) able to identify possible welding problems, component values, shorts, polarity and many other parameters that can be set on the machines according to the technical and functional characteristics of the boards. Should the optical control not be effective, then an X-RAY inspection in degrees will take place in order to inspect the junctions that are not externally visible such as in case of BGA components.
In addition we are equipped to perform ionic contamination tests, impedances calculation and verification, metallographic specimens with the measurement of all the PCB specific thicknesses.
Testing on request can be performed such as programming of cards and complete or partial functional testing. During the testing, the measured data are stored by the computer system and reported on special documentation that verify their compliance.